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For many years, we have focused on polishing fluids, abrasives, polishing pads,
oil thinners, thinners, various cleaning agents, paint removers,
water glass silica sol, and organic solvent products.
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- Polishing Fluid
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- Polishing Fluid
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0622023113
Mobile: 0622023113
WeChat: 15820932092
Email: yuyuancheng839@gmail.com
Thailand Address: Chonburi, Thailand
China Address: Building 4, No. 692, Dalingshan Section, Shida Road, Dalingshan Town, Dongguan City, Guangdong Province, China
Silicon CMP Polishing Slurry
TJHG-SH-2125
I. Product Introduction
TJHG-SH-2125 silicon material CMP polishing slurry is a high-end product developed and manufactured by Guangdong Tengjun Chemical Technology Co., Ltd., used for polishing various silicon wafers and crystal materials. This product features high removal rate, good surface roughness, and no scratching. It has been used on multiple production lines in China, meeting production requirements and can replace existing imported products of the same type.
II. Main Features
TJHG-SH-2125 silicon material CMP polishing slurry uses our independently synthesized SiO2 hydrosol as the abrasive. The abrasive synthesis process and the production of the polishing slurry are fully automated, ensuring batch-to-batch stability and consistency. Compared with similar products, this product has good stability and dispersibility; controllable particle size, allowing for the production of products with different particle sizes to meet different needs, utilizing large-diameter silica particles to achieve high-speed polishing; excellent polished surface effect and no damage to the workpiece, achieving high flatness processing, etc.
III. Main Uses
Mainly used for polishing silicon wafers and other semiconductor materials.
IV. Basic Parameters
| PH Value | Specific Gravity | Viscosity(mPa.s，25℃) | Particle Size(nm) | SiO2% | Appearance |
| 10.0-12.5 | 1.265-1.300 | ≤5 | 100-150 | 38-42 | Milky White |
V. Usage Method:
It is recommended that the ratio of TJHG-SH-2125 slurry to deionized water be 1:15-20. The ratio can be adjusted according to actual process requirements.
VI. Precautions
1. Avoid direct exposure of the slurry during use to prevent contaminants from entering and causing scratches.
2. In winter, when the temperature is low (<5℃), the slurry should not be placed outdoors and must be stored in a temperature-controlled warehouse. Once gelation occurs, it will be unusable.
3. During slurry use, pipes and equipment should be cleaned promptly to prevent slurry residue from forming gels in the pipes and containers, which can scratch the wafer surface.
4. When recycling the slurry, a filter should be added to the inlet to prevent gel formation and repeated use, which could cause scratches on the wafer surface.
VII. Transportation and Storage
1. The transportation and storage temperature should be 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent deterioration of the polishing solution.
2. Shelf life is one year; it is recommended to use within six months.
3. Avoid contamination by metals or particles, and avoid contact with strong electrolytes.
Packaging Specifications
25kg/drum, 250kg/drum, 1000kg/drum
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