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For many years, we have focused on polishing fluids, abrasives, polishing pads,
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0622023113
Mobile: 0622023113
WeChat: 15820932092
Email: yuyuancheng839@gmail.com
Thailand Address: Chonburi, Thailand
China Address: Building 4, No. 692, Dalingshan Section, Shida Road, Dalingshan Town, Dongguan City, Guangdong Province, China
Sapphire Substrate CMP Polishing Fluid
TJHG-SH-558
I. Product Introduction
TJHG-SH-558 sapphire substrate CMP polishing fluid is a high-purity colloidal slurry produced by Guangdong Tengjun Chemical Technology Co., Ltd. This product is a new generation of sapphire substrate CMP polishing fluid developed to meet the needs of the sapphire industry for improved processing efficiency. It is used in the double-sided polishing process of 4-inch sapphire substrate wafers, and has achieved good results since its market launch. The product features high removal rate, strong suspension, easy cleaning, and long service life in CMP processing.
II. Main Features
TJHG-SH-558 sapphire substrate CMP polishing fluid uses nano-silica hydrolysate produced by our company as the abrasive, featuring high concentration, good particle size uniformity, and low impurity contamination. The auxiliary reagents used in this product are mostly organic, avoiding corrosion of equipment and operational hazards caused by inorganic substances. The product is non-toxic and odorless, suitable for use in the well-sealed production environment of the sapphire industry. In CMP processes, it features easy cleaning, high removal efficiency, and high polishing smoothness. Different formulations can be optimized during CMP to achieve the best results. Furthermore, the product does not crystallize during CMP, causes minimal scratches, exhibits good stability, and is non-toxic and odorless.
III. Main Applications
Primarily used for high-quality planarization of sapphire substrates of various sizes.
IV. Basic Parameters
| PH value | Specific gravity | Viscosity(mPa.s，25℃) | Particle size(nm) | SiO2% | Appearance |
| 10.0-12.0 | 1.265-1.300 | ≤5 | 110-130 | 38-42 | Milky white |
V. Usage Method:
The recommended ratio of TJHG-SH-558 sapphire polishing slurry to deionized water is 1:1 for circulation or 1:2-3 for non-circulation. The ratio can also be adjusted according to actual requirements.
VI. Precautions
1. Avoid direct exposure of the CMP polishing slurry during use to prevent contaminants from entering the slurry and causing scratches.
2. In winter, when the temperature is low (<5℃), the slurry should not be placed outdoors but stored in a temperature-controlled warehouse. Once gelation occurs, it will be unusable.
3. During use, pipes and equipment should be cleaned promptly to prevent slurry residue from remaining in pipes and containers and causing gelation, which can lead to scratches on the wafer surface.
4. When recycling the polishing slurry, a filter should be added to the inlet to prevent gelation and repeated use, which can cause scratches on the wafer surface.
VII. Transportation and Storage
1. The transportation and storage temperature should be 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent deterioration of the polishing slurry.
2. Shelf life is one year; it is recommended to use within six months.
3. Avoid contamination by metals and particles, and avoid contact with strong electrolytes.
VIII. Packaging Specifications
25kg/drum, 250kg/drum, 1000kg/drum
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