Product Center

I. Product Introduction

HPHE/SLPS-IE-2012 CMP polishing slurry is a new generation of water-soluble, high-purity colloidal slurry produced by Guangdong Tengjun Chemical Technology Co., Ltd. This product is used in the precision surface processing of stainless steel materials, achieving a high-brightness, visually defect-free polishing effect. It has excellent applications in electronic products such as mobile phones, tablets, and digital cameras. In practical applications, this product has been fully affirmed by customers due to its superior performance, including high concentration and high dilution ratio. It is mainly used in the CMP process of stainless steel and has been successfully applied by major mobile phone OEM customers in China.

II. Main Features

HPHE/SLPS-IE-2012 CMP polishing slurry contains brighteners and corrosion inhibitors during formulation, which greatly improves the surface brightness and perfection during the CMP process of stainless steel. This product features low surface tension, easy cleaning, high polishing rate, and low polished mirror roughness. When applied to the CMP process of stainless steel, it can reduce or eliminate watermarks. This product also features polishing and passivation functions, making it suitable for polishing processes requiring a high mirror finish. Different formulations can be optimized during the CMP process to achieve the best results.

III. Main Applications

HPHE/SLPS-IE-2012 CMP polishing slurry is primarily used in the polishing of stainless steel.

IV. Basic Parameters

V. Usage Method:

Mix the CMP polishing slurry with deionized water according to the process specifications. For HPHE/SLPS-IE-2012 polishing slurry used in the CMP process for stainless steel, a 1:1 ratio of raw slurry to deionized water is recommended.

VI. Precautions

1. Avoid direct exposure of the CMP polishing slurry during use to prevent contaminants from entering the slurry and causing scratches. 2. In winter, when the temperature is low (<5℃), the polishing slurry should not be placed outdoors. It must be stored in a temperature-controlled warehouse. Once gelation occurs, it will be unusable.

3. During use, the pipelines and equipment should be cleaned promptly to prevent the polishing slurry from remaining in the pipelines and containers for extended periods, causing gelation and surface scratches.

4. When recycling the polishing slurry, a filter device should be added to the inlet to prevent gelation and repeated use, which could cause scratches on the wafer surface.

VII. Transportation and Storage

1. The transportation and storage temperature is 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent deterioration of the polishing slurry.

2. Shelf life is one year; it is recommended to use within six months.

3. Avoid contamination by metals and particles, and avoid contact with strong electrolytes.

VIII. Packaging Specifications

25kg/drum, 250kg/drum, 1000kg/drum