Product Center

I. Product Introduction

TJHG-SH-1855 gallium arsenide CMP polishing slurry is a new generation of water-soluble, high-purity CMP slurry produced by Guangdong Tengjun Chemical Technology Co., Ltd. It features good stability, high concentration, and fast polishing speed. In practical applications, this product has been highly praised by customers for its excellent performance, including high dilution ratio and low metal ion contamination. It is mainly used in the polishing process of gallium arsenide wafers.

II. Main Features

TJHG-SH-1855 CMP polishing slurry uses high-purity nano-SiO2 hydrosol, synthesized and produced in-house, as the abrasive. It features high automation in production, good stability, high concentration, good particle size uniformity, and low impurity contamination. The auxiliary reagents used in this product are mostly organic, avoiding corrosion of equipment and operational hazards caused by inorganic substances. The product is non-toxic and odorless, making it ideal for the polishing process of gallium arsenide wafers used in integrated circuits. Different formulations can be optimized as needed during polishing to achieve the best results. Compared with similar products, this product effectively controls various metal contaminants on the wafer surface, and its main parameters meet IC requirements.

III. Main Applications

TJHG-SH-1855 CMP slurry is mainly used for high-quality polishing of gallium arsenide wafers, and can also be used for polishing germanium wafers.

IV. Basic Parameters

V. Usage Method:

Mix the polishing slurry with deionized water in a certain proportion according to the process before use.

VI. Precautions

1. Avoid direct exposure of the paste during use to prevent contaminants from entering and causing scratches.

2. In winter, when the temperature is low (<5℃), the paste should not be placed outdoors but stored in a temperature-controlled warehouse. Once gelation occurs, it will be unusable.

3. Clean pipelines and equipment promptly during paste use to prevent paste residue from accumulating in pipelines and containers, causing gelation and scratches on the wafer surface.

4. When recycling the paste, a filter device should be added to the pipeline inlet to prevent gelation and repeated use, which could cause scratches on the wafer surface.

VII. Transportation and Storage

1. The transportation and storage temperature is 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent paste deterioration.

2. Shelf life is one year; it is recommended to use within six months.

3. Avoid contamination by metals and particles, and avoid contact with strong electrolytes.

Packaging Specifications

25kg/drum, 250kg/drum, 1000kg/drum