

Aluminum Alloy CMP Slurry
TJHG-IE-1912
I. Product Introduction
HPHE/AAPS-IE-1912 CMP polishing slurry is a new type of high-purity colloidal polishing slurry developed by Guangdong Tengjun Chemical Technology Co., Ltd. This product is widely used in the CMP process of aluminum alloy frames. During CMP processing, it features high removal rate, strong suspension, easy cleaning, and long service life, achieving good mirror finish and perfection. In the processing of aluminum alloy materials for high-tech products, it achieves excellent visual effects and improves product precision. In practical applications, this product has been fully affirmed by customers for its superior performance, including uniform particle size and high concentration.
II. Main Features
HPHE/AAPS-IE-1912 CMP polishing slurry uses nano-sized SiO2 hydrosol with a suitable particle size as the abrasive, featuring high removal rate, strong suspension, easy cleaning, and long service life. During the CMP process, different formulations can be optimized as needed to avoid workpiece corrosion, improve the surface gloss of the workpiece, and achieve the best surface effect.
III. Main Applications
Mainly used in CMP processes for aluminum alloys.
IV. Basic Parameters
| PH Value | Specific Gravity | Viscosity(mPa.s,25℃) | Particle Size(nm) | SiO2% | Appearance |
| 9.0-11.0 | 1.265-1.300 | ≤5 | 80-100 | 38-42 | Milky white |
V. Usage Method:
It is recommended that the ratio of TJHG-IE-1912 CMP slurry to deionized water be 1:1. The ratio can be adjusted according to actual process requirements.



VI. Precautions
1. Avoid direct exposure of the CMP slurry during use to prevent contaminants from entering the slurry and causing scratches.
2. In winter, when the temperature is low (<5℃), the slurry should not be placed outdoors and must be stored in a temperature-controlled warehouse. Once gelation occurs, it will be unusable.
3. During paste use, pipelines and equipment should be cleaned promptly to prevent paste residue from forming in the pipelines and containers, which can cause gelation and scratches on the wafer surface.
4. When recycling paste, a filter device should be added to the inlet to prevent gelation and repeated use, which can cause scratches on the wafer surface.
VII. Transportation and Storage
1. The transportation and storage temperature should be 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent paste deterioration.
2. Shelf life is one year; it is recommended to use within six months.
3. Avoid contamination by metals and particles, and avoid contact with strong electrolytes.
Packaging Specifications
25kg/drum, 250kg/drum, 1000kg/drum
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