

Silicon CMP Polishing Slurry
TJHG-SH-2034
I. Product Introduction
TJHG-SH-2034 silicon material CMP polishing slurry is a high-end product manufactured by Guangdong Tengjun Chemical Technology Co., Ltd., widely used in the polishing process of large-size silicon wafers. In practical applications, this product has been highly praised by customers for its superior performance, including high concentration, high purity, low metal ion contamination, high rate stability, and good consistency. Since its market launch, this product has received positive feedback from numerous customers and has passed testing on multiple production lines in China, achieving excellent application results and reaching the performance level of imported products from the US and Japan.
II. Main Features
TJHG-SH-2034 silicon material CMP polishing slurry uses SiO2 hydrosol, synthesized in-house, as the abrasive. The synthesis process employs a new synthesis technology and automated production control, improving particle size uniformity and purity compared to traditional colloids, making it specifically designed for high-end products. The product formulation process employs a closed-loop, automated method. All auxiliary reagents adhere to strict testing standards and are prepared and synthesized on-site, avoiding product quality issues caused by instability during raw material storage. Different formulation ratios can be optimized as needed during polishing to achieve the best performance. Compared to similar products from the US and Japan, this product offers advantages such as high concentration, controllable abrasive particle size, low surface tension, easy cleaning of organic matter, metal ions, and particles, high polishing rate, no heterogeneous pitting at high temperatures, and excellent polishing consistency.
III. Main Applications
Primarily used for high-quality polishing of multi-diffused silicon wafers, it can also be used for polishing processes of raw germanium, silicon dioxide, and other materials.
IV. Basic Parameters
| PH Value | Specific Gravity | Viscosity(mPa.s,25℃) | Particle Size(nm) | SiO2% | Appearance |
| 10.0-12.5 | 1.265-1.300 | ≤5 | 120-140 | 38-42 | Milky white |
V. Usage Method:
The recommended mixing ratio of TJHG-SH-2034 slurry to deionized water is 1:15-20. This ratio can be adjusted according to actual process requirements.
VI. Precautions
1. Avoid direct exposure of the slurry during use to prevent contaminants from entering and causing scratches.
2. In winter, when the temperature is low (<5℃), the slurry should not be placed outdoors but stored in a temperature-controlled warehouse. If gelation occurs, the slurry will be unusable.
3. During slurry use, pipes and equipment should be cleaned promptly to prevent slurry residue from remaining in pipes and containers, which can cause gelation and scratches on the wafer surface.
4. When recycling the slurry, a filter device needs to be added to the inlet to prevent gelation and scratches on the wafer surface caused by repeated use.
VII. Transportation and Storage
1. The transportation and storage temperature is 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent deterioration of the polishing solution.
2. Shelf life is one year; it is recommended to use within six months.
3. Avoid contamination by metals or particles, and avoid contact with strong electrolytes.
Packaging Specifications
25kg/drum, 250kg/drum, 1000kg/drum
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