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TJHG-SH-1804 ceramic material CMP polishing slurry is a water-soluble, high-purity colloidal slurry produced by Guangdong Tengjun Chemical Technology Co., Ltd., widely used in ceramic sheet polishing processes. In practical applications, this product has been highly praised by customers for its excellent performance, including high concentration, high purity, low metal ion contamination, high rate stability, and good consistency.

TJHG-SH-1804 ceramic material CMP polishing slurry uses SiO2 hydrosol, synthesized in-house, as the abrasive. The synthesis process employs a new synthesis technology and automated production control, improving particle size uniformity and purity compared to traditional colloids. The product formulation process utilizes a closed-loop automated production method, ensuring batch-to-batch stability. This product offers high removal rate, excellent surface finish, is environmentally friendly, and harmless to humans. Different formulation ratios can be optimized as needed during polishing to achieve the best results. This type of product also features high concentration, controllable abrasive particle size, low surface tension, and easy cleaning.

Mainly used for polishing various ceramic materials.

It is recommended that the ratio of TJHG-SH-1804 slurry to deionized water be 1:15 and 1:20, respectively. The ratio can also be changed according to actual process requirements.

VI. Precautions

1. Avoid direct exposure of the slurry during use to prevent contaminants from entering and causing scratches.

2. In winter, when the temperature is low (<5℃), the slurry should not be placed outdoors and must be stored in a temperature-controlled warehouse. Once gelation occurs, it will be unusable.

3. During paste use, pipelines and equipment should be cleaned promptly to prevent paste residue from forming in the pipelines and containers, which can cause gelation and scratches on the wafer surface.

4. When recycling paste, a filter device should be added to the inlet to prevent gelation and repeated use, which can cause scratches on the wafer surface.

VII. Transportation and Storage

1. The transportation and storage temperature should be 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent paste deterioration.

2. Shelf life is one year; it is recommended to use within six months.

3. Avoid contamination by metals and particles, and avoid contact with strong electrolytes.

Packaging Specifications

25kg/drum, 250kg/drum, 1000kg/drum