Product Center

I. Product Introduction

ZZC CMP polishing slurry is a new generation of water-soluble, high-purity CMP slurry produced by Guangdong Tengjun Chemical Technology Co., Ltd. It features good stability, high concentration, and fast polishing speed. In practical applications, this product has been highly praised by customers for its excellent performance, including high dilution ratio and low metal ion contamination. It is mainly used in the polishing process of CZC wafers.

II. Main Features

The CZC CMP slurry uses high-purity nano-SiO2 hydrosol, synthesized and produced in-house, as the abrasive. It features high automation in production, good stability, high concentration, good particle size uniformity, and low impurity contamination. The auxiliary reagents used are mostly organic, avoiding corrosion of equipment and operational hazards caused by inorganic substances. The product is non-toxic and odorless, making it ideal for polishing CZC wafers. Different formulations can be optimized as needed to achieve the best results. Compared with similar products, this product effectively controls various metal contaminations on the wafer surface, and its main parameters meet IC requirements.

III. Main Applications

Cadmium Zinc Telluride (ZZC) CMP polishing slurry is mainly used for rough polishing and high-quality polishing of wafers, and can also be used for polishing germanium wafers.

IV. Basic Parameters

V. Usage Method:

Mix the polishing slurry with deionized water in a certain proportion according to the process before use.

VI. Precautions

1. Avoid direct exposure of the slurry during use to prevent contaminants from entering the slurry and causing scratches.

2. In winter when the temperature is low (<5℃), the slurry should not be placed outdoors and should be stored in a temperature-controlled warehouse. Once gelation occurs, it cannot be used.

3. During the use of the slurry, the pipelines and equipment need to be cleaned in a timely manner to avoid long-term slurry residue in the pipelines and containers causing gelation and scratches on the wafer surface.

4. When recycling the slurry, a filter device needs to be added to the inlet to prevent gelation and scratches on the wafer surface caused by repeated use.

VII. Transportation and Storage

1. The transportation and storage temperature is 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent deterioration of the polishing solution.

2. Shelf life is one year; it is recommended to use within six months.

3. Avoid contamination by metals or particles, and avoid contact with strong electrolytes.