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For many years, we have focused on polishing fluids, abrasives, polishing pads,
oil thinners, thinners, various cleaning agents, paint removers,
water glass silica sol, and organic solvent products.
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- Polishing Fluid
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- Polishing Fluid
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0622023113
Mobile: 0622023113
WeChat: 15820932092
Email: yuyuancheng839@gmail.com
Thailand Address: Chonburi, Thailand
China Address: Building 4, No. 692, Dalingshan Section, Shida Road, Dalingshan Town, Dongguan City, Guangdong Province, China
Indium Phosphide Polishing Slurry
I. Product Introduction
Indium phosphide polishing slurry is a new generation of water-soluble, high-purity CMP slurry produced by Guangdong Tengjun Chemical Technology Co., Ltd. It features good stability, high concentration, and fast polishing speed. In practical applications, this product has been highly praised by customers for its excellent performance, including high dilution ratio and low metal ion contamination. It is mainly used in the polishing process of indium phosphide wafers.
II. Main Features
The slurry uses high-purity nano-SiO2 hydrosol, synthesized and produced in-house, as the abrasive. It features high automation in production, good stability, high concentration, good particle size uniformity, and low impurity contamination. The auxiliary reagents used in this product are mostly organic, avoiding corrosion of equipment and operational hazards caused by inorganic substances. The product is non-toxic and odorless, making it ideal for wafer polishing processes. Different formulations can be optimized as needed to achieve the best results. Compared with similar products, this product effectively controls various metal contaminations on the wafer surface, and its main parameters meet IC requirements.
III. Main Applications
Mainly used for high-quality polishing of wafers.
IV. Basic Parameters
| PH Value | Specific Gravity | Viscosity(mPa.s，25℃) | Particle Size(nm) | SiO2% | Appearance |
| 10.0-12.5 | 1.265-1.300 | ≤5 | 120-140 | 38-42 | Milky White |
V. Precautions
1. Avoid direct exposure of the slurry during use to prevent contaminants from entering and causing scratches.
2. In winter, when the temperature is low (<5℃), the slurry should not be placed outdoors but stored in a temperature-controlled warehouse. Once gelation occurs, it will be unusable.
3. During slurry use, pipes and equipment should be cleaned promptly to prevent slurry residue from remaining in pipes and containers, causing gelation and scratches on the wafer surface.
4. When recycling the slurry, a filter device should be added to the pipe inlet to prevent gelation and repeated use, which could cause scratches on the wafer surface.
VI. Transportation and Storage
1. The transportation and storage temperature should be 5-40℃, with 25℃ being the optimal storage temperature. Store away from light to prevent deterioration of the polishing solution.
2. Shelf life is one year; it is recommended to use within six months.
3. Avoid contamination by metals or particles, and avoid contact with strong electrolytes.
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