

Damping Cloth (Semiconductor) Polishing Pad
I. Product Introduction
This product has strong adhesion, effectively controlling the back-immersion of polishing slurry. It is reusable, with a TTV ≤ 8. This product can be used in various standard sizes, such as 4-inch, 6-inch, and 8-inch. Custom sizes are also available to suit gallium arsenide, indium phosphide, zinc cadmium telluride, silicon carbide, and germanium wafers.
II. Basic Parameters
| Item | Data |
| Thickness (µm) | 600 |
| Density (g/cm³) | 0.46 |
| Compressive Elasticity (%) | 18±3 |
| Pore Depth (mm) | 0.15-2.0 |
III. Instructions for Use
1. Apply to a clean, dry surface only at room temperature. If a suitable solvent (such as isopropyl alcohol) was used to clean the ceramic disc when removing the old unwaxed pad, ensure the ceramic disc is completely dry and at room temperature before application. Excessive temperature or residual cleaning solvent on the ceramic disc will reduce adhesive adhesion.
2. When applying the unwaxed pad to the ceramic disc, peel off the release paper from one edge of the pad. Fold the release paper back approximately 2 inches, align the unwaxed pad with the edge of the ceramic disc, and press it firmly onto the disc using a hand roller.
IV. Transportation and Storage
1. Transport and store at a temperature of 10-24°C and a relative humidity of 30-70%. Store away from light to prevent deterioration of the polishing solution.
2. Shelf life is one year; use within six months is recommended.
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