

Semiconductor Polishing Pad Fiber Pad
I. Product Introduction
This product is a composite material of fiber and polyurethane, featuring a fibrous structure with optimized micropores, good elasticity, and no impurities. It offers high polishing speed, can withstand heavy-duty polishing, and has a long lifespan. During polishing, it effectively impregnates the workpiece with polishing fluid, increasing cutting force while preventing scratches. It is resistant to acids and alkalis. This product can be customized in size and grooved according to process requirements and customer specifications.
II. Main Applications
Suitable for semiconductor materials such as sapphire, silicon, germanium, and gallium arsenide.
III. Basic Parameters
| Model Number | PP5427M0201 |
| Thickness | 1.6mm |
| Density | 0.53g/cm³ |
| Hardness | 70-75shoreA |
| Tensile Strength | 13.8-17.1 MPa |
| Tear Strength | 2.3-3.6 N/cm |
IV. Instructions for Use
1. Apply to a clean, dry surface only at room temperature. If a suitable solvent (such as isopropyl alcohol) was used to clean the ceramic disc when removing the old unwaxed pad, ensure the ceramic disc is completely dry and at room temperature before application. Excessive temperature or residual cleaning solvent on the ceramic disc will reduce adhesive adhesion.
2. When applying the unwaxed pad to the ceramic disc, peel off the release paper from one edge of the pad. Fold the release paper back approximately 2 inches, align the unwaxed pad with the edge of the ceramic disc, and press it firmly onto the disc using a hand roller.
V. Transportation and Storage
1. Transport and store at a temperature of 10-24°C and a relative humidity of 30-70%. Store away from light to prevent deterioration of the polishing solution.
2. Shelf life is one year; use within six months is recommended.
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