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These semiconductor components are used in the core parts of electronic industry equipment, including computer-centric FA equipment, OA equipment, video recording devices, audio products, automotive electronic equipment, and communication electronic equipment. To manufacture these semiconductor components, silicon-based semiconductor wafers or compound semiconductor wafers must undergo uniform surface processing. The most suitable polishing material for this surface processing is FO, a fine polishing material incorporating FUJIMI technology. FO is an alumina-based fine polishing material that achieves excellent particle shape and hardness through carefully selected materials and a unique manufacturing process. Manufactured under strict crystal quality management, it maintains consistent polishing performance while preventing scratches. Therefore, it not only provides excellent processing performance for semiconductor crystals but also for optical materials such as lenses, prisms, and glass, and can be confidently used for high-value-added processing.