

Semiconductor Polishing Pad Fiber Pad
I. Product Introduction
This product is a composite material of fiber and polyurethane, featuring a fibrous structure with optimized micropores, good elasticity, and no impurities. It boasts a high polishing rate, can withstand heavy-duty polishing, and has a long lifespan. During polishing, it effectively impregnates the workpiece with polishing fluid, improving cutting force while preventing scratches. It is resistant to acids and alkalis. This product can be customized in size and grooved according to process requirements and customer specifications.
II. Main Applications
Suitable for semiconductor materials such as sapphire, silicon, germanium, and gallium arsenide.
III. Basic Parameters
| Model | PP5427M0201 |
| Thickness | 1.6mm |
| Density | 0.53g/cm³ |
| Hardness | 70-75shoreA |
| Tensile Strength | 13.8-17.1 MPa |
| Tear Strength | 2.3-3.6 N/cm |
IV. Instructions for Use
1. Apply to a clean, dry surface only at room temperature. 1. If you used a suitable solvent (such as isopropyl alcohol) to clean the ceramic disc when removing the old unwaxed pad, please ensure the ceramic disc is completely dry and at room temperature before applying the pad. Excessive temperature or residual cleaning solvent on the ceramic disc will reduce the adhesive's adhesion.
2. When applying the unwaxed pad to the ceramic disc, peel off the release paper from one edge of the pad. Fold the release paper back approximately 2 inches, align the unwaxed pad with the edge of the ceramic disc, and then use a hand roller to slowly apply even pressure to press the pad onto the ceramic disc.
V. Transportation and Storage
1. Transport and store at a temperature of 10~24°C and a relative humidity of 30~70%. Store away from light to prevent the polishing solution from deteriorating.
2. Shelf life is one year; it is recommended to use within six months.
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