① Temperature: Increased temperature enhances the chemical reaction of the polishing slurry, increasing the polishing rate. However, excessively high temperatures can cause the polishing slurry to evaporate and accelerate the chemical reaction, leading to severe surface corrosion and uneven polishing results, thus reducing polishing quality.
② pH Value: The higher the pH value of the polishing slurry, the stronger its alkalinity and the faster the reaction rate. However, pH value significantly affects the etching of the polished surface, the decomposition and solubility of abrasives, and the stability of the polishing slurry, thereby affecting material removal rate and surface quality. Therefore, it should be strictly controlled.
③ Pressure: Generally, higher pressure results in a faster polishing rate. However, when the pressure is sufficiently high, the polishing rate will decrease slightly because the polishing pad's ability to hold the polishing slurry decreases. Furthermore, high pressure can easily cause fragmentation.
④ Rotation speed: Increasing the rotation speed will increase the polishing rate. However, excessively high rotation speed will cause uneven distribution of the polishing slurry on the polishing pad, affecting the polishing quality.
⑤ Polishing slurry concentration: Increasing the concentration of the polishing slurry will increase the removal rate. However, when the abrasive concentration exceeds a certain value, the material removal rate will stop increasing and remain at a constant value. This phenomenon is called removal saturation. Furthermore, excessively high concentrations may increase surface defects (scratches), affecting the surface quality.